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Wednesday, April 2, 2014

Intel Outlines New Computing Opportunities, Investments and Collaborations with Burgeoning China Technology Ecosystem

Intel Corporation CEO Brian Krzanich outlined, at INTEL DEVELOPER FORUM, Shenzhen, China, April 2, 2014, the company's plans to build upon its nearly 30-year history in China, and collaborate with the growing technology ecosystem, particularly in Shenzhen, to accelerate new innovation and reshape the computing industry.
  • Intel CEO announces Intel Smart Device Innovation Center in Shenzhen and US$100 million Intel Capital China Smart Device Innovation Fund to accelerate smart device innovation including 2 in 1s, tablets, smartphones, wearables and the Internet of Things.
  • Makes first public, live call using China Mobile's TD-LTE network and Intel® XMM™ 7260 LTE advanced platform.
  • Demonstrates Intel SoFIA for the first time just months after adding the new family of integrated Intel® Atom™-based mobile SoCs for entry and value smartphones and tablets to its roadmap.
  • Announces availability of the Intel® Gateway Solutions for the Internet of Things based on Intel® Quark™ and Intel® Atom™ processors.
Source: http://newsroom.intel.com/community/intel_newsroom/blog/2014/04/01/intel-ceo-outlines-new-computing-opportunities-investments-and-collaborations-with-burgeoning-china-technology-ecosystem

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